ALEXANDRIA, Va., July 30 -- United States Patent no. 12,371,785, issued on July 29, was assigned to Tokyo Electron Ltd. (Tokyo). "Method for forming film on substrate surface having convex portion" w... Read More
ALEXANDRIA, Va., July 30 -- United States Patent no. 12,375,441, issued on July 29, was assigned to VeriSign Inc. (Reston, Va.). "Externally applying internal network domain name system (DNS) policie... Read More
ALEXANDRIA, Va., July 30 -- United States Patent no. 12,371,212, issued on July 29, was assigned to VIRGIN FRUIT Inc. (Miami). "Packaging and method for plant matter" was invented by Wilson Quintero ... Read More
ALEXANDRIA, Va., July 30 -- United States Patent no. 12,371,435, issued on July 29, was assigned to MIRATI THERAPEUTICS INC. (Princeton, N.J.). "Substituted imidazo[1,2-cpyrimidines as PRC2 inhibitor... Read More
ALEXANDRIA, Va., July 30 -- United States Patent no. 12,372,610, issued on July 29, was assigned to TSINGHUA UNIVERSITY (Beijing). "Method and system for processing radar signal based on photonic fra... Read More
ALEXANDRIA, Va., July 30 -- United States Patent no. 12,369,520, issued on July 29, was assigned to Precision Planting LLC (Tremont, Ill.). "Magnetic indexing of agricultural sensors" was invented by... Read More
ALEXANDRIA, Va., July 30 -- United States Patent no. D1,085,965, issued on July 29, was assigned to PACCAR Inc (Bellevue, Wash.). "Quarter fender" was invented by Louis Daniel Heilaneh (Denton, Texas... Read More
ALEXANDRIA, Va., July 30 -- United States Patent no. 12,376,457, issued on July 29, was assigned to HEFEI BOE JOINT TECHNOLOGY Co. LTD. (Anhui, China) and BOE TECHNOLOGY GROUP Co. LTD. (Beijing). "Di... Read More
ALEXANDRIA, Va., July 30 -- United States Patent no. 12,373,636, issued on July 29, was assigned to GRAMMARLY INC.. "Rewriting tone of natural language text" was invented by Alice Shen (Berkeley, Cal... Read More
ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,634, issued on July 29, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei, China). "Chip structure and semiconductor structure compr... Read More